DEEP DIVE: Passive Electronic Components: World Market Outlook: 2021-2026 ISBN #1-893211-99-1 (2021)

Paumanok Publications, Inc. has published the new updated global market research report on PASSIVE ELECTRONIC COMPONENTS with forecasts to 2026, on the following markets-

• CAPACITORS

• RESISTORS

• INDUCTORS

DOWNLOAD FULL TABLE OF CONTENTS HERE-

https://paumanokgroup.sharefile.com/d-s8ce1a37e85954e6696008dd90d597360

__________________________________________________________________________________________

The study, entitled “Passive Electronic Components: World Market Outlook: 2021-2026 ISBN #1-893211-99-1 (2021)” is designed for manufacturers, distributors and end-users of passive electronic components that update their supply chain information on an annual basis and is in its 34th year of publication. This report offers a granular look at the global and regional markets for 14 sub-types and 53 configurations of passive electronic component, including-

• CAPACITORS:

o MLCC Ceramic, Aluminum, Tantalum, DC Film, AC Film and Carbon Supercapacitors.

♣ Aluminum, Axial Leaded Al203:

♣ Carbon, EDLC Supercapacitors (Carbon):

♣ Aluminum, SMD V-Chip (Al203):

♣ Aluminum, Organic H-Chip (Al203):

♣ Aluminum, Radial Leaded (Al203):

♣ Aluminum, Snap-In (Al203):

♣ Aluminum, Large Can (Al203):

♣ Ceramic, 0402 MLCC (Chips (0402 BaTI02):

♣ Ceramic, 0603 MLCC (Chips (0603 BaTI02):

♣ Ceramic, 0805 MLCC (Chips (0805 BaTI02):

♣ Ceramic, 1206 MLCC (Chips (1206 BaTI02):

♣ Ceramic, 1210-1225 MLCC (Chips (1210-1225 BaTI02):

♣ Ceramic, High-CV MLCC (Chips All Sizes BaTI02 In Hydrothermal, alk-oxide or sol-gel):

♣ Ceramic, Specialty Capacitors:

♣ Tantalum, Molded Chip A Case (Manganese Cathode):

♣ Tantalum, Molded Chip B Case (Manganese Cathode):

♣ Tantalum, Molded Chip C Case (Manganese Cathode):

♣ Tantalum, Molded Chip D Case (Manganese Cathode):

♣ Tantalum, Molded Chip E/X Case (Manganese Cathode):

♣ Tantalum, Molded Chip A Case (Polymer Cathode):

♣ Tantalum, Molded Chip B Case (Polymer Cathode):

♣ Tantalum, Molded Chip C Case (Polymer Cathode):

♣ Tantalum, Molded Chip D Case (Polymer Cathode):

♣ Tantalum, Molded Chip E/X Case (Polymer Cathode):

♣ Plastic Film; Axial Leaded Plastic Film (Polyethylene Terephthalate Plastic Film Dielectric):

♣ Plastic Film: Film Chips (PPS, PEN and PET Films):

♣ Plastic Film: Radial Leaded Plastic Film (PET Plastic Film):

♣ Plastic Film: Suppression Film (Snubber/X&Y):

o

• RESISTORS:

o Thick Film Chip, Network and Array; Nichrome Metal Film, Tin-Oxide, Wirewound, Thin Film, Carbon Film;

♣ Thick Film Chip Resistors (0201 Case Size Ru02 Thick Film on 96% Alumina)

♣ Thick Film Chip Resistors (0402 Case Size Ru02 Thick Film on 96% Alumina)

♣ Thick Film Chip Resistors (0603 Case Size Ru02 Thick Film on 96% Alumina)

♣ Thick Film Chip Resistors (0805 Case Size Ru02 Thick Film on 96% Alumina)

♣ Thick Film Chip Resistors (1206 Case Size Ru02 Thick Film on 96% Alumina)

♣ Thick Film Chip Resistors (1210-2512 Case Size Ru02 Thick Film on 96% Alumina)

♣ Carbon Film Resistor, Axial and Radial Leaded:

♣ Metal Foil: (Nickel + Chromium Metal Foil in Axial, Radial and SMD Configurations):

♣ Tin-Oxide: (Antimony – 10 Resistive Element, also called Flameproof and High Voltage Resistors:

♣ Nichrome Film (Nickel + Chromium Deposited Metal Film on Ceramic Core):

♣ Power Wirewound (Nickel + Chromium Wire wound on a Ceramic Core):

♣ Resistor Network, The Multichip Array Network:

♣ Resistor Network, Coated SIP Network

♣ Resistor Network, SMD DIP Network:

♣ Resistor Network, Molded DIP Network

♣ Resistor Network, Molded SIP Network

♣ Thin Film Chips 0402 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films

♣ Thin Film Chips 0603 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films

♣ Thin Film Chips 0805 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films:

♣ Thin Film Chips 1206 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films:

♣ Thin Film Chips 1210-2512 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films

• INDUCTORS:

o Horizontal Wirewound Inductors; Wirewound Chip Coil inductors, ferrite beads and bead arrays; multilayered chip inductors, axial and radial leaded inductors, ferrite cores, thin film inductor chips.

♣ Axial and Radial Leaded Micro-Inductors:

♣ Chip Coils:

♣ Ferrite Beads:

• RAW MATERIALS:

♣ Nickel (For Electrode Powder & Paste)

♣ Copper (For Termination Powder & Paste):

♣ Aluminum (For Capacitor Foil; Alumina Substrates):

♣ Zinc (Zinx-Oxide):

♣ Palladium (Electrode Powders & Pastes):

♣ Ruthenium (For Resistor Inks):

♣ Tantalum Ore, Powder and Wire (For Tantalum Anode):

♣ Silver (For Electrodes and Terminations):

♣ Crude Oil (For Plastics):

GLOBAL MARKETS:

The report makes future price, value and volume forecasts for each passive component as well as a historical record of demand cycles over the past decade and forecasts the value, volume and pricing for passive components by type from FY 2021 to 2026.

• Value and Volume of Consumption for Passive Components By Type and Configuration: Capacitors, Resistors and Inductors-FY 2021-2026 Forecasts

• Average Unit Selling prices for Passive Electronic Components by Type and Configuration: Capacitors, Resistors and Inductors-FY 2021-2026 Forecasts

• 120 Months of Lead Time data for 53 Sub-Types of Passive Electronic Component and Their Raw Materials

• Sales of Passive Electronic Components by Type and World Region: FY 2021-2026

• Sales of Passive Electronic Components by Type and End-Use Market Segment: FY 2021-2026

• Market Shares for Manufacturers of Passive Electronic Components by Type and Configuration: FY 2021

• Forecasts for Capacitors, Resistors and Inductors by Type and Configuration: FY 2021-2026

END-USE MARKETS:


The study estimates global consumption value by end-use market segment, including circuit applications such as -

• Wireless Handsets

• Computer and business machine markets

• Consumer audio and video imaging and home theatre end markets

• Industrial electronics and power supplies

• Automotive electronic sub-assemblies

• Specialty and defense end-use markets;

REGIONAL MARKETS:

The study also addresses global consumption value by world region and key country of consumption And addresses changes in each of these localized markets in FY 2021.

• China and SE Asia

• Japan

• Euope

• Americas

MANUFACTURER MARKET SHARES:

The report also offers detailed market share data for each subset of the passive component industry including market shares in

• MLCC Capacitor Manufacturers: FY 2021 Global Market Shares

• Tantalum Capacitor Manufacturers: FY 2021 Global Market Shares

• Aluminum Electrolytic Capacitor Manufacturers: FY 2021 Global Market Shares

• Plastic Film Capacitor Manufacturers: FY 2021 Global Market Shares

• Thick Film Chip Resistor Manufacturers: FY 2021 Global Market Shares

• Resistor Network, Array and IPD Manufacturers: FY 2021 Global Market Shares

• Nichrome Metal Film Resistor Manufacturers: FY 2021 Global Market Shares

• Tin-Oxide Resistor Manufacturers: FY 2021 Global Market Shares

• Wirewound Resistor Manufacturers: FY 2021 Global Market Shares

• Discrete Inductor Manufacturers: FY 2021 Global Market Shares

LEAD TIMES: 120 MONTHS OF DATA: March 2012-March 2021

• CAPACITORS: Lead Times by Capacitor Dielectric, Type and Configuration by Month March 2012-March 2021

• RESISTORS: Lead Times by Resistor Type and Configuration by Month March 2012-March 2021

• INDUCTORS: Lead Times by Resistor Type and Configuration by Month March 2012-March 2021

120 Months of Lead Time Data By Component Type and Configuration for Capacitors, Resistors and Inductors.

FORECASTS: 2021-2026

The report makes future price, value and volume forecasts for each passive component as well as a historical record of demand cycles over the past decade and forecasts the value, volume and pricing for the different types of passive component reviewed in the report from FY 2021 to 2026.

MANUFACTURER PROFILES:

All major vendors of Passive Components are discussed in this report, including Bourns, Chilisin, Coilcraft, Inc., KOA Corporation, Kyocera Corporation (AVX), Nichicon Corporation, Nippon Chemi-Con Corporation, Panasonic Electronic Devices Company Limited, Murata Manufacturing Company Limited, Rohm Company Limited, Rubycon Corporation, Samsung Electro-Mechanical, Sumida Electric Company Limited, Shenzhen Sunlord Electronics Corporation, TA-I Electronics Company Limited, Taiyo Yuden Corporation, TDK Corporation, TT Electronics PLC, Vishay Intertechnology, Inc., Walsin Technology Corp., and Yageo Corporation (KEMET).

____
This report was released in March 2021 and documents the impact of the current regional economic conditions on the passive component industry and the end-markets into which capacitors, resistors and inductors are sold. Detailed forecasts for value, volume and pricing for each year until 2026. Now in its 34th year of publication, this edition is 300 pages and includes 152 tables and graphs, The study covers fixed capacitors, linear resistors and discrete inductors in 11 sub-categories including 53 individual component markets. Our most popular report. Written by Dennis M Zogbi.

DOWNLOAD TABLE OF CONTENTS HERE-

https://paumanokgroup.sharefile.com/d-s8ce1a37e85954e6696008dd90d597360